News and Events
Paper submission deadline (Extended) Oct. 12, 2020
Author Notification Oct. 28, 2020
Camera-ready paper submission and author registration Nov. 6, 2020

The 2020 14th IEEE Dallas Circuits and Systems Conference, which was to be held at the Erik Jonsson School of Engineering and Computer Science of the University of Texas at Dallas Campus, on November 15 and 16, 2020, will be held online instead due the pandemic circumstances. This conference, co-sponsored by the IEEE Circuits and Systems (CAS) Society, the IEEE Solid-State Circuits Society, the IEEE Electron Devices Society and the University of Texas at Dallas, will feature a comprehensive program of technical papers, poster sessions and keynote speakers. In this year, meeting contributions will be in all areas of Circuits, Systems and Data processing, including but not limited to the following:

  • VLSI design and methodologies
  • Analog and RF mixed signal design and ICs
  • Synthesis, DFT and Verification Methodologies
  • Design for Manufacturability and Yield
  • Hardware-Software Co-Design
  • Device-Circuit Co-Design
  • Power Systems and Power Electronics
  • Computer Aided Design
  • Low-Power Design
  • Temperature-Aware Design
  • Devices and Modeling
  • Communications
  • Nanoscale Computing and Nano-Electronics
  • High Performance Computing
  • Quantum Computing and Spintronics
  • Multi-core and Parallel Architectures
  • Networks-on-chip
  • Embedded Systems
  • Sensors and Sensor Arrays
  • Signals and Systems
  • Reconfigurable Systems
  • Education in Circuits and Systems
  • Internet of Things
  • Cyber-Physical Systems
  • Artificial Intelligence Circuits and Architectures
  • Hardware Security
  • Emerging Technologies
  • Big Data Processing
  • Compressive Sensing
  • Cognitive Computing and Deep Learning
  • Smart Systems for Automotive
  • Personalized Healthcare Systems
  • Sustainable Computing and Systems
  • Innovative Neurotechnologies
  • Energy-Aware Systems and Services
  • Power Management, Energy Harvesting, and Wireless Power
  • 5G and Multi-Gigabit Optoelectronics Comm
  • Audio and Video Processing
  • Packaging